With the world of Notebooks getting more diverse, the demand for more efficient and versatile processors is at an all time high. Intel is all in with their new Intel Core processors with Hybrid Technology. Intel has named this project ‘Lakefield’.
Leveraging intel’s Foveros 3D packaging technology, Intel hits the market running with their 10th generation processors. Foveros is a technology that allows these chips to be built in a three dimensional manor. Picture the ability to build a layered cake where you can mix in different components of the chip together.
The new Hybrid Technology Chip or “Lakefield” gives Intel the ability to pile layers of cool technology on top of each other. Each of these layer is a mere 12mm x 12mm x 1mm (high). The 56% smaller package area and 47% smaller board size opens up a world of possibility with single, dual and foldable screens. The smaller and more efficient board also gives the your notebook more battery life between charges. Lakefield is Intel’s first chip to feature native duel internal display pipes which means they are perfectly suited for foldable and dual screen PCs.
The intel Core i5 and i3 leverage a 10nm Sunny Cove core should you require some heavy lifting, while the Tremont quad core offers a great balance between performance and the ability to have tasks going on in the background. Each of these are compatible with both 32 and 64-bit Windows Applications.
“Intel Core processors with Intel Hybrid Technology are the touchstone of Intel’s vision for advancing the PC industry by taking an experience-based approach to designing silicon with a unique combination of architectures and IPs. Combined with Intel’s deepened co-engineering with our partners, these processors unlock the potential for innovative device categories of the future.”
–Chris Walker, Intel corporate vice president and general manager of Mobile Client Platforms
Currently you can get the new Hybrid Technology processors in the Lenovo ThinPad X1 Fold and as well the Samsung Galaxy Book S, which was covered in a previous article.
I must admit that this sounds super cool. Being able to reduce the footprint and build these technologies on top of each other is fascinating. It will be interesting to see how integration goes with OEMs as there seems to be a new ‘cool’ foldable notebook being released every week.
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